| PART |
Description |
Maker |
| TSSOP MSOP TSSOP-EP MSOP-EP |
SMALL OUTLINE PACKAGES
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| IC51-1387KS-15186 IC53-0502-912 IC51-1035KS-10460 |
SOP (Small Outline Packages, Gullwing Leads)
SOP (Small Outline Packages, Gullwing Leads)
|
List of Unclassifed Manufacturers
List of Unclassifed Manufac...
List of Unclassifed Man...
|
| M24.173B |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP) 薄小外形Wxposed垫塑料封装（EPTSSOP
From old datasheet system
|
INTERSIL[Intersil Corporation]
|
| SBR05U20LP SBR05U20LP-7 |
SBR® Super Barrier Rectifiers: Small Outline Packages
Surface Mount Super Barrier Rectifier
|
Dionics Inc.
IRF[International Rectifier]
|
| HYM324000GD-60 HYM324000GD-50 |
4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE 4M X 32 FAST PAGE DRAM MODULE, 60 ns, ZMA72
CAP 0.5PF 50V /-0.2PF THIN-FILM SN96/AG4/NI 30PPM TR-7-PA
4M x 32 Bit DRAM Module (SO-DIMM)
-4M x 32-Bit Dynamic RAM Module SMALL OUTLINE MEMORY MODULE
|
SIEMENS A G
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| TC1221 TC1221ECH TC1222 TC1222ECH TC1221ECHTR TC12 |
The TC1221/1222 are CMOS "charge-pump" voltage converters in ultra-small 6-Pin SOT-23A packages. They invert and/or double an input ...
The TC1221/1222 are CMOS "charge-pump" voltage converters in ultra-small 6-Pin SOT-23A packages. They invert and/or double an input voltage which can range from 1.8V to 5.5V. Conversion efficiency is typically 96%. Switching frequency is
From old datasheet system
(TC1222) High Frequency Switched Capacitor Voltage Converters with Shutdown in SOT Packages
(TC1221) High Frequency Switched Capacitor Voltage Converters with Shutdown in SOT Packages
|
MICROCHIP[Microchip Technology]
|
| MT8LDT864HXS MT4LDT464H MT4LDT464HS MT4LDT464HX MT |
SMALL-OUTLINE DRAM MODULE
|
MICRON[Micron Technology]
|
| MT8LSDT464H |
SMALL-OUTLINE SDRAM MODULE
|
Micron Technology
|
| MT16VDDF12864H MT16VDDF12864HG-202 MT16VDDF12864HG |
SMALL-OUTLINE DDR SDRAM DIMM
|
Micron Technology
|
| SSOP24 |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
|
STMicroelectronics
ST Microelectronics
|
| CSSOP |
Ceramic Shrink Small Outline Package
|
Amkor Technology
|
| AP2318GEN-HF AP2318GEN-HF-14 |
Capable of 2.5V Gate Drive, Small Outline Package
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
